|
ITEM |
Process Capability | Tolerance | |
| Board Thickness (mm) |
Flexible single-sided printed board | Min:0.05 | ±0.03 |
| flexible double-sided printed board | Min:0.14 | ±0.03 | |
| Fexible mulitlayer printed circuit board | Min:0.2 4 layer, If there is impedance, it needs to be negotiated separately.) | ±0.05 | |
| Rigid-flex board(RFPC) | Min:0.3 (4 layer, If there is impedance, it needs to be negotiated separately.) Max:1.6 |
±0.05(Board Thickness1.0以上:±10%) | |
| Dimensions (mm) |
working size | Min:250 X 270 / Max:500 X 500 | - |
| DrillingSize | Min:0.15 / Max:6.5 | PTH:±0.075 / NPTH:±0.05 | |
| Laser | Min:0.1 | ||
| B1-Line margin PAD side | Normal:0.15(Min:0.13) | - | |
| B2-Line margin N-PTH hole edge | Normal:0.15(Min:0.13) | - | |
| B3-Line margin PTHhole edge | Normal:0.25(Min:0.205) | - | |
| B4-Line margin forming | Normal:0.3(Min:0.2，Depending on the use of forming Tooling) | - | |
| Forming size | - | a. PCB routing tolerance :±0.15 b. UV tolerance :±0.1 c. Etching die :±0.1 (Depending on the forming size) d. steel die :±0.1 e.ccd :±0.05 |
|
| Conductor width/space (finished Product) |
No Electrolytic Plating | 1 oz -> 2.0/3.7 mil | >3mil→ ±20% ≦3mil→ ±0.6mil |
| 1/2 oz --> 2.0/3.0 mil | |||
| 1/3 oz -->2.0/3.05 mil | |||
| Horizontal Electrolytic Plating (double-sided) | 1/2 oz --> 2.0/3.5 mil | >4mil→ ±20% ≦4mil→ ±0.8mil |
|
| 1/3 oz --> 2.0/2.75 mil | |||
| Horizontal Electrolytic Plating (mulitlayer&RFPC) | 1/2 oz --> 2.0/4.0 mil | >4mil→ ±20% ≦4mil→ ±0.8mil |
|
| 1/3 oz --> 2.0/3.25 mil | |||
| Ring | Normal: 4 mil | ±20% | |
| Wire bonding Pad(Pitch) | 0.18mm | ±0.03 | |
| Finger(Pitch) | 0.3mm | ±0.03 (Depending on finger size) | |
| Solder mask (finished Product) |
Opening Clearance(A1-PTH PAD / BGA PAD) | Normal: 3 mil (Min:2.6) | - |
| Opening Clearance(A2-NPTH) | |||
| Opening to Edge(A3-By CNC Formation) | Normal: 1.0mm (Min:0.5mm) | ||
| Opening to Edge(A3-By Model Formation) | Normal: 2.0mm (Min:1.0mm) | ||
| Solder Dam(Yellow) | Min:4 mil | ||
| Solder Dam (Green) | Min:4 mil | ||
| Solder Dam (Dark) | Min:5 mil | ||
| Thickness | 25um | ±5 | |
| Copper Plating Capability | 通孔縱橫比 | - | |
| 盲孔縱橫比 | - | ||
| Dimple | - | Media thickness±20% | |
| Copper Plating Thickness | 1). 15.5+/-2.5um ( 0.6+/-0.1mil )， 2). 17.5+/-2.5um ( 0.7+/-0.1mil )， 3). Face copper+/- 0.2mil |
- | |
| Epoxy Via Plug | Plug hole aspect ratio | The hole diameter calculation needs to be calculated based on the copper thickness of the plated hole. | |
| Surface Finished | Electroless Nickel Immersion Gold | Au:0.05~0.5um (2~20u") Ni:1.5~9um(50~350u") |
±6% ±10% |
| Ｅlectroplating nickel/gold | Au:0.05~0.6um (2~24u") Ni:1.5~20um(50~500u") |
±6% ±30% |
|
| Electroless Nickel Electroless Palladium Immersion Gold | Au:0.05~0.2um (2~8u") Pd:0.05~0.2um (2~8u") Ni:1.5~20um(50~500u") |
±6% ±6% ±30% |
|
| Printing of Legend | Text ink | Min width:4.0 mil Thickness:20±10µm HxW :100 x 100um ( Min : 80 x 80 um) |
The offset±0.30mm |
| Thermal Curable Flexible Solder Resist Ink | Thickness:20±10µm | The offset±0.30mm | |
| Photoimageable Solder Resist Ink | Thickness:25±5µm | ||
| Silver paste | Thickness:15±10µm | The offset±0.30mm | |
| Impedance control (ohm) |
Differential | - | ±10% |
| Single | |||
| Alignment | Drilling Machine Tolerances | - | ±0.05mm |
| Line Exposure Mechanical Tolerance | ±0.05mm | ||
| PSR Exposure Mechanical Tolerance | ±0.05mm | ||
| Stiffener Lamination deviation | Normal:±0.3mm (Blending jigMin±0.2mm) |
||
| Coverlay Lamination deviation | |||
| Silver Film Lamination deviation | |||
| Coverlay glue overflow | - | ±0.15mm | |
| Gold finger expansion and contraction from the 1st Pin to the last 1Pin | Related to the use of materials | >50mm→±10/100000 ≦50mm→±0.05mm |
|
| Gold finger offset from the center of the 1st (or last) Pin to the edge of the board | Use a special-shaped punching machine±0.05mm | ±0.10mm | |